The Flexible Packaging Scholarship

The Flexible Packaging Division encourages students to pursue careers in packaging through an award program that provides a one-time scholarship of $2500 to an outstanding student studying Flexible Packaging or a related field.

Details about the scholarship and the application link can be found by clicking on the Flexible Packaging Division’s logo below:

Questions about the Scholarship? Contact Barry Morris, Chair of the Flexible Packaging Scholarship Committee.

Congratulations to the Winners of this Scholarship!


2019 Scholarship Award

Michaela Gibson is a junior Packaging Science major with an emphasis in Materials at Clemson University. Currently, she is serving as the Vice President of the Clemson University SPE Student Chapter. She also works in the CEFPACK (Center for Flexible Packaging) Lab on campus where she performs various tests using ASTM standards. Set to graduate in December 2021, Michaela foresees multiple opportunities in which she could pursue her career in packaging but has an interest in working for a toy company focusing on child-friendly packaging designs.

Past Recipients

2018 Alix Regnier

2017 Logan Tate